1) the IPC - ESD - 2020: electrostatic discharge control program development standard of joint. Including electrostatic discharge control program to design, build, implement and maintain. According to some experience of the military and commercial organizations and for electrostatic discharge processing guide and protect sensitive period.

2) IPC - SA - 61 - A: half water into cleaning manual after welding. Including half water into all aspects of the cleaning, including chemical residue, equipment, production, technology, process control and environmental and safety considerations.

3) the IPC - AC - 62 - a: after welding aqueous cleaning manual. Describe manufacturing residue, the types and properties of aqueous cleaner, water into a cleaning process, equipment and processes, quality control, environmental control and the safety of employees and the cost of the test of cleanliness and.

4) IPC - DRM - 4 0 e: hole weld evaluation desktop reference manual. According to the standard requirements of components, the hole wall and the welding surface covering such detailed description, in addition also includes computer generated 3 d graphics. Covers the complete tin, contact Angle and wetting, vertical filling, welding pad cover and a large number of welding point

Its defects.

5) IPC - TA - 722: manual welding technology evaluation. Include all aspects of welding technology of 45 articles, content involves ordinary welding materials, welding, manual welding, batch, wave soldering, reflow soldering, welding the weld and infrared gas phase.

6) the IPC - 7525: template design guidelines. For the solder paste and surface-mount adhesive coating templates provide guidelines to design and manufacture of the I also discussed the application of template design of surface-mount technology, and introduces the hole or flip chip components with you? Kun technology, including overprint, double seal and phase type template design.

7) IPC/EIA J - STD - 004: a flux of the specifications of the demand with appendix I. Contains rosin, resin and other technical indicators and classification, according to the flux of halide content and activation of organic and inorganic flux; Also includes the use of the flux, material containing flux, and no clean process used in the low residual flux.

8) IPC/EIA J - STD - 005: the specifications of the solder paste requirements including appendix I. Lists the characteristics and technical index requirements of solder paste, including test method and the metal content standards, as well as the viscosity, collapse, solder balls, viscosity and wetting properties of solder paste.

9) the IPC/EIA J - STD - 0 6 a: electronic grade solder alloy, flux and the flux of the specifications of the solid solder requirements. For electronic grade solder alloy, bar, strip, powdered flux and the flux of the solder, for the application of electronic soldering, offer special electronic grade solder term name, specification requirements and test methods.

10) IPC - Ca - 821: the general requirements of thermal conductive adhesive. Including the cement components suitable location of the thermal conductivity of the dielectric requirements and test methods.

11) the IPC - 3406: conductive surface coating binder guide. As the solder in the electronic manufacturing alternatives provide guidance for the selection of conductive adhesive.

12) IPC - AJ - 820: assembly and welding handbook. Contains descriptions of assembling and welding inspection technology, including the terms and definitions; Printed circuit board, components and pin type, welding point of installation, design specification reference materials, components and outline; Welding technology and packaging; Cleaning and labeling; Quality assurance and testing.

13) the IPC - 7530: batch (reflow soldering and wave soldering) welding process temperature curve guide. Used in the temperature curve to obtain all kinds of test means, technology and methods, in order to establish the best graphics provide guidance.